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IEEE DTS Conference Chair

Pr. Mohamed Masmoudi
National Engineering School of Sfax (ENIS) - Tunisia


Sponsors & Partners


Technical Program Summary


IEEE DTS’20 Plenary Session

Keynote 1

Topics in Nanopackaging

Plenary Session Summary:

We live in an Information Age driven by the astonishing progression of solid state electronics over the past 70 years since the invention of the transistor, and especially by the relentless march forward driven by industrial roadmaps based on faith in the infallibility of Moore’s Law. But even as Moore’s Law falters in the face of the challenges of nanoscale device manufacturing, new applications are opening up, e.g. flexible electronics, wearables, Internet of Things, quantum computing, etc. As IC chips became bigger and on-chip devices became smaller, electronics packaging, which has provided the chip with mechanical support, environmental protection, thermal dissipation, signal and power integrity, and system reliability from mainframe computers and PCs to smart phones, has kept pace through comparable innovations. Electronics packaging areas are becoming more specialized in meeting new environmental challenges, e.g. biomedical, oil well, space, aeronautics, and of that information center formerly known as an automobile! The current “grand challenges” for electronics packaging are 3D system integration by chip-stacking, embedded passives to provide more board real estate for active silicon, and the continuing battle against increasing power dissipation.

Nanotechnologies offer a variety of materials options for reliability improvements in microelectronics packaging, primarily in the applications of nanocomposites, or in the exploitation of the superior properties of carbon nanotubes and graphene. Nanoparticle composite materials are studied for resistors, high-k dielectrics, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancements, while nanowires, CNTs and graphene may also find thermal, interconnect, and shielding applications. The presentation will briefly cover electronics packaging as an introduction to nanopackaging, and then will emphasize some selected recent developments in the field, specifically:

  • Printed and sintered nanoparticle interconnects
  • Nanoparticle film sensors for electronics package reliability
  • Carbon nanotube (CNT) applications

and concluding with some relevant EHS (environment, health and safety) cautions.

Full name: Pr. James E. Morris
Affiliation:Department of Electrical & Computer Engineering Portland State University Portland, Oregon 97207-0751, USA

Presenter Biography:
Jim is Professor Emeritus of Electrical & Computer Engineering at Portland State University, Oregon, USA, with B.Sc. and M.Sc. degrees in Physics from the University of Auckland, New Zealand, and a Ph.D. in Electrical Engineering from the University of Saskatchewan, Canada. He was awarded an honorary doctorate by the Politehnica University of Bucharest in 2015. He is an IEEE Life Fellow and an Electronics Packaging Society (EPS) Distinguished Lecturer. He has served the EPS in multiple roles for 25 years, including 20 years on the Board of Governors and periods as Treasurer and Conferences VP. He is now equally involved in the IEEE Nanotechnology Council (NTC), currently in 2019 as President-Elect, and recently serving as General Chair for NMDC 2018. His research activities are focused on electrically conductive adhesives, the electrical conduction mechanisms in discontinuous metal nanoparticle thin films, and on nanotechnology education. He has edited or co-authored five books on electronics packaging, (two of which have been published in Chinese,) and two on nanodevices. The second edition of the Nanopackaging book was published by Springer in 2018.


Keynote 2

Recent advances in wireless charging

Plenary Session Summary:

The field of wireless power transfer (WPT) has been developing significantly. Wireless Power Transfer completely eliminates the existing high tension power transmission lines ,cables, and towers.Electric Vehicles (EV) have been proposed to achieve green transportation. Even though EV usage is currently increasing, a technology breakthrough would be required to overcome battery related drawbacks.

Wireless power transfer provides inherent electrical isolation and reduces on board charging cost, weight and volume. Nevertheless, WPT for EVs pose additional challenges and sustainability trade-offs and concerns that have stimulated discussion in academia and industry. In this presentation, we first review existing technologies for both stationary and dynamic charging of vehicles. We then propose a wireless power transfer technology using microwaves for the wireless charging of stationary EVs. It involves the design of a beam forming phased array antenna as a transmitter (TX) distributed on the parking walls or on garage walls that transmit power to the receiver antenna in the car. We use a phased array antenna technology to control and adjust the microwave power beam in order to increase efficiency and to reduce unexpected radiation outside of the receiving antenna. The harvested RF power is converted into DC supply to charge the battery while the EV parks over nightby using an appropriate rectenna circuit. This technology lends itself also to lower levels of power needed for wearable and IoT devices as will be demonstrated for applications in health care.


Full name: Pr. Mohammed Ismail Elnaggar
Affiliation:Department of Electrical and Computer Engineering Wayne State University, USA

Presenter Biography:


Keynote 3

Towards Self-Aware Systems-on-Chip Through Intelligent Cross-Layer Coordination

Plenary Session Summary:

Although there is a rich history of cross-layer design for embedded computing systems to achieve desired QoS, we are facing ever more challenges from the intertwined goals of energy- efficiency, thermal design constraints, as well as resilience to errors emanating from the application, environment and hardware platforms. We posit that next-generation computing platforms must necessarily deploy intelligent cross-layer design achieved through self-awareness principles inspired by biology and nature. Such an approach will move us from current strategies (using limited cross-layer coordination) to a holistic cross-layer strategy that enables intelligent cross-layer management policies which can adaptively tune itself based on the current state of the system. The talk will present design exemplars that embrace this intelligent cross-layer approach, and highlight the role of self-awareness in achieving dynamic adaptivity.

Full name: Pr. Fadi J Kurdahi
Affiliation:Center for Embedded & Cyber-physical Systems, University of California, Irvine

Presenter Biography:

Fadi Kurdahi received his PhD from the University of Southern   California in 1987. Since then, he has been a faculty at the   Department of Electrical & Computer Engineering at UCI, where he   conducts research in the areas of Computer Aided Design and design methodology of large scale   systems. He serves as the Associate Dean for Graduate and Professional Studies of the Henry Samueli School of Engineering, and the Director of the Center for   Embedded & Cyber-physical Systems (CECS), comprised of world-class researchers in the general area of Embedded and Cyber-physical Systems. He served on numerous editorial boards, and was program chair or general chair on program committees of several workshops,  symposia and conferences in the area of CAD, VLSI, and system design.   He received the best paper awards for the IEEE Transactions on VLSI in  2002, ISQED in  2006 and ASP-DAC in 2016, and other   distinguished paper awards at DAC, EuroDAC, ASP- DAC and ISQED. He also received the Distinguished Alumnus award from his Alma Mater, the   American University of Beirut in 2008. He is a Fellow of the IEEE and the AAAS.